Shanghai, China (March 18, 2025) - Texas Instruments (NASDAQ: TXN) today introduced a global microminiature MCU, further expanding its full portfolio of Arm® Cortex-M0 + MSPM0 MCUS. The MSPM0C1104 MCU is in a wafer-on-chip package (WCSP) measuring just 1.38mm2, or about the size of a black peppercorn-allowing designers to optimize the layout space for compact applications such as medical wearables and personal electronics without compromising performance.
"In ultra-small systems such as earplugs and medical probes, board space is a scarce and valuable resource," said Vinay Agarwal, vice president and general manager of Texas Instruments' MSP microcontroller division. "Thanks to this global ultra-small MCU, our MSPM0 MCU portfolio opens up endless possibilities to make our everyday experiences smarter and more connected."
Texas Instruments' MSPM0 MCU portfolio includes more than 100 cost-effective MCUS that offer scalable on-chip analog peripherals configurations and multiple computing options to enhance sensing and control for embedded designs. This series of devices has been presented at the grand International Embedded Exhibition held in Nuremberg, Germany.
Ultra-small package, unlimited possibilities
Consumers continue to demand that everyday electronic devices, such as electric toothbrushes and stylus pens, not only be smaller and less expensive, but also have more functions. To innovate in reducing product size, engineers increasingly need to use small integrated components to increase functionality while maintaining space on the board. MSPM0C1104 MCU gives full play to the advantages of WCSP packaging technology, through careful function selection and Texas Instruments cost optimization program, so that its 8-ball WCSP size is only 1.38mm2, 38% smaller than similar products.
The MCU is equipped with 16KB of memory, a 12-bit three-channel analog-to-digital converter, and 6 universal input/output pins. It is compatible with standard communication interfaces such as universal asynchronous transceivers (UART), serial peripheral interfaces (SPI), and internal integrated circuits (I2C). This global ultra-small MCU integrates precise high-speed analog components, enabling engineers to maintain the computing performance of embedded systems without increasing the size of the board.
Cover design needs from small to large using the same MCU product family
Texas Instruments has added the new MSPM0C1104 to its MSPM0 MCU portfolio, which combines scalability, cost optimization and ease of use to reduce time to market. Texas Instruments' MSPM0 MCUS offer pin-to-pin compatible package options and feature sets to meet the memory, analog and computing power needs of personal electronics, industrial and automotive applications. In addition, the portfolio offers a variety of small package options to help optimize fabric size and streamline the bill of materials. With this optimization and functional integration, engineers have the flexibility to design products of various sizes while reducing system cost and complexity.
Further support is provided by Texas Instruments' comprehensive ecosystem, which includes software development kits optimized for all MSPM0 MCUS, hardware development kits for rapid prototyping, reference designs, and subsystems that serve as examples of common MCU functional code. With Texas Instruments' Zero Code Studio tool, users can configure, develop and run MCU applications in just minutes without writing any code. Engineers can leverage this ecosystem to scale design and reuse code without making major changes to hardware or software. In addition to this ecosystem, Texas Instruments continues to invest in increasing in-house manufacturing capabilities to meet future demand, which also supports the MSPM0 MCU portfolio.