Name: 8-layer HDI soft and hard combined PCB
Layer number: 8L(2R+4F+2R)
Plate thickness: 1.03mm soil 10%
Material: S1000-2M+ polyimide (Shengyi)
Line width spacing: 0.076/0.1mm
Minimum aperture: 0.10mm
Surface treatment: sunk nickel gold
Special process: Second order HDI, laser open cap, HI-POT